Characterization of A Novel FR4/AlN Printed Circuit Board of High Thermal Conductivity

Diancheng Qin; Yonglong Xiao; Kewei Liang

doi:doi:10.11648/j.am.20180702.13

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Characterization of A Novel FR4/AlN Printed Circuit Board of High Thermal Conductivity

Diancheng Qin, Yonglong Xiao, Kewei Liang

Published in Advances in Materials (Volume 7, Issue 2)

Received: 14 May 2018 Accepted: 6 June 2018 Published: 29 June 2018

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Abstract

High thermally conductive cuboid aluminum nitride block was used as reinforcement material to fill the FR4 matrix for the fabrication of a novel FR4/AlN PCB (Printed Circuit Board) with high thermal conductivity. This novel PCB was subjected to a thermal shock test of 1500 cycles from -40°C keeping 30 minutes to 125°C keeping 30 minutes during 1000 hours with transfer time less than 10 seconds, presented an excellent reliability since there was no crack and delamination emerging. By performing a comparative study between FR4/AlN PCB and anodized MCPCB, it was found that the thermal resistance of both PCB were 0.63°C /W and 2.74°C /W respectively. When CREE XTE LEDs were mounted on FR4/AlN PCB and anodized MCPCB using SMT technology to dissipate heat respectively, the LEDs’ junction temperature were 37°C and 42.1°C and the overall corresponding thermal resistance were 3.93°C /W and 6.43°C /W accordingly. Therefore, a conclusion can be drawn that this novel PCB exhibits a more excellent heat dissipation performance than 30W/m·K anodized MCPCB does and it is a promising alternative of MCPCB for heat dissipation of high power electronic devices like LEDs.

Published in	Advances in Materials (Volume 7, Issue 2)
DOI	10.11648/j.am.20180702.13
Page(s)	26-33
Creative Commons	This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited.
Copyright	Copyright © The Author(s), 2018. Published by Science Publishing Group

Keywords

FR4/AlN PCB, Anodized PCB, Heat Dissipation, LED, Junction Temperature, Thermal Resistance

References

[1]	Yong Hu, Guoping Du, Nan Chen (2016). A novel approach for Al₂O₃/resin composites with high strength and thermal conductivity. Composites Science and Technology 124, 36-43.
[2]	M. Wasim Akhtar, Yun Seon Lee, Dong Jin Yoo and Jong Seok Kim (2017). Alumina-graphene hybrid filled resin composite: Quantitative validation and enhanced thermal conductivity. Composites Part B 131, 184-195.
[3]	Wenhui Yuan, Qiangqiang Xiao and Li Li (2016). Thermal conductivity of resin adhesive enhanced by hybrid graphene oxide/AlN particles. Applied Thermal Engineering 106, 1067-1074.
[4]	Seran Choi, Jooheon Kim (2013). Thermal conductivity of resin composites with a binary-particle system of aluminum oxide and aluminum nitride fillers. Composites: Part B 51, 140–147.
[5]	Osman Eksik, Stephen F. Bartolucci and Tushar Gupta (2016). A novel approach to enhance the thermal conductivity of resin nanocomposites using graphene core shell additives. Carbon 101, 239-244.
[6]	So Youn Mun, Hyung Mi Lim and Seung-Ho Lee (2018). Thermal and electrical properties of resin composite with expanded graphite-ceramic core-shell hybrids. Materials Research Bulletin 97, 19-23.
[7]	Zhifang Gao and Lei Zhao (2015). Effect of nano-fillers on the thermal conductivity of resin composites with micro-Al2O3 particles. Materials and Design 66, 176-182.
[8]	Mehdi Derradji, Xuemei Song and Abdul Qadeer Dayo (2017). Applied Thermal Engineering. Applied Thermal Engineering 115, 630-636.
[9]	QIN Diancheng, LI Baozhong and XIAO Yonglong (2017). Current Status and Development of Ceramic Metallization. China Ceramic Industry 24 (05), 30-36.
[10]	QIN Dian-cheng，CHEN Ai-bing and XIAO Yong-long (2018). Preparation of Anodic Alumina Substrate and Its Application in LED Heat Dissipation. Journal of Synthetic Crystals 47 (01), 225-230.
[11]	SUN Yan-le, XUAN Tian-peng and XU Shao-nan (2010). Research Advances on Anodic Oxidation of Aluminum Alloy. Plating and Finishing 32 (04), 18-21.
[12]	ZHOU Ke-ke, HUANG Yan-bin and SANG Hao-ran (2016). Effect of Aluminum Alloy Anodic Oxidation Film Structure on the Adhe-sive Property. Surface Technology 45 (09), 188-193.
[13]	Qin Diancheng，Li Baozhong and Huang Yizhao (2017). Interface Morphology and Thermal Conductivity of Ceramic-Embedded FR4 Structure. semiconductor technology 42 (11), 864-869.
[14]	S. F. Sufian, M. Z. Abdullah (2017). Heat transfer enhancement of LEDs with a combination of piezoelectric fans and a heat sink. Microelectronics Reliability 68, 39–50.
[15]	Thi My Linh Dang, Chang-Yeoul Kim and Yaming Zhang (2017). Enhanced thermal conductivity of polymer composites via hybrid fillers of anisotropic aluminum nitride whiskers and isotropic spheres. Composites Part B 114, 237-246.
[16]	Yuan-Xiang Fu, Zhuo-Xian He and Dong-Chuan Mo (2014). Thermal conductivity enhancement of resin adhesive using graphene sheets as additives. International Journal of Thermal Sciences 86, 276-283.
[17]	Liuyan Yin, Xingui Zhou and Jinshan Yu (2016). Fabrication of a polymer composite with high thermal conductivity based on sintered silicon nitride foam. Composites: Part A 90, 626-632.
[18]	Shi-hui Song, Hideyuki Katagi, Yoshitaka Takezawa (2012). Study on high thermal conductivity of mesogenic resin resin with spherulite structure. Polymer 53, 4489-4492.
[19]	Hyungu Im and Jooheon Kim (2012). Thermal conductivity of a graphene oxide–carbon nanotube hybrid/resin composite. CARBON 50, 5429-5440.

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APA Style

Diancheng Qin, Yonglong Xiao, Kewei Liang. (2018). Characterization of A Novel FR4/AlN Printed Circuit Board of High Thermal Conductivity. Advances in Materials, 7(2), 26-33. https://doi.org/10.11648/j.am.20180702.13

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ACS Style

Diancheng Qin; Yonglong Xiao; Kewei Liang. Characterization of A Novel FR4/AlN Printed Circuit Board of High Thermal Conductivity. Adv. Mater. 2018, 7(2), 26-33. doi: 10.11648/j.am.20180702.13

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AMA Style

Diancheng Qin, Yonglong Xiao, Kewei Liang. Characterization of A Novel FR4/AlN Printed Circuit Board of High Thermal Conductivity. Adv Mater. 2018;7(2):26-33. doi: 10.11648/j.am.20180702.13

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@article{10.11648/j.am.20180702.13,
  author = {Diancheng Qin and Yonglong Xiao and Kewei Liang},
  title = {Characterization of A Novel FR4/AlN Printed Circuit Board of High Thermal Conductivity},
  journal = {Advances in Materials},
  volume = {7},
  number = {2},
  pages = {26-33},
  doi = {10.11648/j.am.20180702.13},
  url = {https://doi.org/10.11648/j.am.20180702.13},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.am.20180702.13},
  abstract = {High thermally conductive cuboid aluminum nitride block was used as reinforcement material to fill the FR4 matrix for the fabrication of a novel FR4/AlN PCB (Printed Circuit Board) with high thermal conductivity. This novel PCB was subjected to a thermal shock test of 1500 cycles from -40°C keeping 30 minutes to 125°C keeping 30 minutes during 1000 hours with transfer time less than 10 seconds, presented an excellent reliability since there was no crack and delamination emerging. By performing a comparative study between FR4/AlN PCB and anodized MCPCB, it was found that the thermal resistance of both PCB were 0.63°C /W and 2.74°C /W respectively. When CREE XTE LEDs were mounted on FR4/AlN PCB and anodized MCPCB using SMT technology to dissipate heat respectively, the LEDs’ junction temperature were 37°C and 42.1°C and the overall corresponding thermal resistance were 3.93°C /W and 6.43°C /W accordingly. Therefore, a conclusion can be drawn that this novel PCB exhibits a more excellent heat dissipation performance than 30W/m·K anodized MCPCB does and it is a promising alternative of MCPCB for heat dissipation of high power electronic devices like LEDs.},
 year = {2018}
}

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TY  - JOUR
T1  - Characterization of A Novel FR4/AlN Printed Circuit Board of High Thermal Conductivity
AU  - Diancheng Qin
AU  - Yonglong Xiao
AU  - Kewei Liang
Y1  - 2018/06/29
PY  - 2018
N1  - https://doi.org/10.11648/j.am.20180702.13
DO  - 10.11648/j.am.20180702.13
T2  - Advances in Materials
JF  - Advances in Materials
JO  - Advances in Materials
SP  - 26
EP  - 33
PB  - Science Publishing Group
SN  - 2327-252X
UR  - https://doi.org/10.11648/j.am.20180702.13
AB  - High thermally conductive cuboid aluminum nitride block was used as reinforcement material to fill the FR4 matrix for the fabrication of a novel FR4/AlN PCB (Printed Circuit Board) with high thermal conductivity. This novel PCB was subjected to a thermal shock test of 1500 cycles from -40°C keeping 30 minutes to 125°C keeping 30 minutes during 1000 hours with transfer time less than 10 seconds, presented an excellent reliability since there was no crack and delamination emerging. By performing a comparative study between FR4/AlN PCB and anodized MCPCB, it was found that the thermal resistance of both PCB were 0.63°C /W and 2.74°C /W respectively. When CREE XTE LEDs were mounted on FR4/AlN PCB and anodized MCPCB using SMT technology to dissipate heat respectively, the LEDs’ junction temperature were 37°C and 42.1°C and the overall corresponding thermal resistance were 3.93°C /W and 6.43°C /W accordingly. Therefore, a conclusion can be drawn that this novel PCB exhibits a more excellent heat dissipation performance than 30W/m·K anodized MCPCB does and it is a promising alternative of MCPCB for heat dissipation of high power electronic devices like LEDs.
VL  - 7
IS  - 2
ER  -

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Author Information

Diancheng Qin

Guangdong LED Packaging-Used Heat Dissipation Substrate Engineering Technology Research Center, Rayben Technologies (Zhuhai) Limited, ZhuHai, China
Yonglong Xiao

Guangdong LED Packaging-Used Heat Dissipation Substrate Engineering Technology Research Center, Rayben Technologies (Zhuhai) Limited, ZhuHai, China
Kewei Liang

Guangdong LED Packaging-Used Heat Dissipation Substrate Engineering Technology Research Center, Rayben Technologies (Zhuhai) Limited, ZhuHai, China

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Plain Text BibTeX RIS

APA Style

Diancheng Qin, Yonglong Xiao, Kewei Liang. (2018). Characterization of A Novel FR4/AlN Printed Circuit Board of High Thermal Conductivity. Advances in Materials, 7(2), 26-33. https://doi.org/10.11648/j.am.20180702.13

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ACS Style

Diancheng Qin; Yonglong Xiao; Kewei Liang. Characterization of A Novel FR4/AlN Printed Circuit Board of High Thermal Conductivity. Adv. Mater. 2018, 7(2), 26-33. doi: 10.11648/j.am.20180702.13

Copy | Download

AMA Style

Diancheng Qin, Yonglong Xiao, Kewei Liang. Characterization of A Novel FR4/AlN Printed Circuit Board of High Thermal Conductivity. Adv Mater. 2018;7(2):26-33. doi: 10.11648/j.am.20180702.13

Copy | Download

@article{10.11648/j.am.20180702.13,
  author = {Diancheng Qin and Yonglong Xiao and Kewei Liang},
  title = {Characterization of A Novel FR4/AlN Printed Circuit Board of High Thermal Conductivity},
  journal = {Advances in Materials},
  volume = {7},
  number = {2},
  pages = {26-33},
  doi = {10.11648/j.am.20180702.13},
  url = {https://doi.org/10.11648/j.am.20180702.13},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.am.20180702.13},
  abstract = {High thermally conductive cuboid aluminum nitride block was used as reinforcement material to fill the FR4 matrix for the fabrication of a novel FR4/AlN PCB (Printed Circuit Board) with high thermal conductivity. This novel PCB was subjected to a thermal shock test of 1500 cycles from -40°C keeping 30 minutes to 125°C keeping 30 minutes during 1000 hours with transfer time less than 10 seconds, presented an excellent reliability since there was no crack and delamination emerging. By performing a comparative study between FR4/AlN PCB and anodized MCPCB, it was found that the thermal resistance of both PCB were 0.63°C /W and 2.74°C /W respectively. When CREE XTE LEDs were mounted on FR4/AlN PCB and anodized MCPCB using SMT technology to dissipate heat respectively, the LEDs’ junction temperature were 37°C and 42.1°C and the overall corresponding thermal resistance were 3.93°C /W and 6.43°C /W accordingly. Therefore, a conclusion can be drawn that this novel PCB exhibits a more excellent heat dissipation performance than 30W/m·K anodized MCPCB does and it is a promising alternative of MCPCB for heat dissipation of high power electronic devices like LEDs.},
 year = {2018}
}

Copy | Download

TY  - JOUR
T1  - Characterization of A Novel FR4/AlN Printed Circuit Board of High Thermal Conductivity
AU  - Diancheng Qin
AU  - Yonglong Xiao
AU  - Kewei Liang
Y1  - 2018/06/29
PY  - 2018
N1  - https://doi.org/10.11648/j.am.20180702.13
DO  - 10.11648/j.am.20180702.13
T2  - Advances in Materials
JF  - Advances in Materials
JO  - Advances in Materials
SP  - 26
EP  - 33
PB  - Science Publishing Group
SN  - 2327-252X
UR  - https://doi.org/10.11648/j.am.20180702.13
AB  - High thermally conductive cuboid aluminum nitride block was used as reinforcement material to fill the FR4 matrix for the fabrication of a novel FR4/AlN PCB (Printed Circuit Board) with high thermal conductivity. This novel PCB was subjected to a thermal shock test of 1500 cycles from -40°C keeping 30 minutes to 125°C keeping 30 minutes during 1000 hours with transfer time less than 10 seconds, presented an excellent reliability since there was no crack and delamination emerging. By performing a comparative study between FR4/AlN PCB and anodized MCPCB, it was found that the thermal resistance of both PCB were 0.63°C /W and 2.74°C /W respectively. When CREE XTE LEDs were mounted on FR4/AlN PCB and anodized MCPCB using SMT technology to dissipate heat respectively, the LEDs’ junction temperature were 37°C and 42.1°C and the overall corresponding thermal resistance were 3.93°C /W and 6.43°C /W accordingly. Therefore, a conclusion can be drawn that this novel PCB exhibits a more excellent heat dissipation performance than 30W/m·K anodized MCPCB does and it is a promising alternative of MCPCB for heat dissipation of high power electronic devices like LEDs.
VL  - 7
IS  - 2
ER  -

Copy | Download