Emerging Technologies on Semiconductor Devices, Circuits and Applications :: Special Issue

Journal of Electrical and Electronic Engineering

Special Issue

Emerging Technologies on Semiconductor Devices, Circuits and Applications

Submission Deadline: 25 October 2020
Status: Submission Closed
Lead Guest Editor: Zeheng Wang

About This Special Issue

Electronics are playing a significant role in the modern technology including aerospace, computer, automation in industries, communication and home appliances. It’s impossible to realize these important circuits without electronics devices. When it comes to functioning of the electronic devices, different parameter counts such as fabrication technique, fabrication environment, active material incorporated in the device, size of the device, packing of the device. To discuss these emerging topics, this special issue of international journal of electrical and electronics engineering, a peer review journal, is going to emphasize on all classes of semiconductor devices and related materials, process and applications. This special issue accepts original research work based on both simulation and experiment.
This issue calls for the experimental/simulation work/proposal based on different electronics devices incorporating different semiconductors. Some advanced circuits related to electrical and electronics can also be accepted. Further, this issue accepts the development of new fabrication and characterization techniques may be used for development of nano/micro devices.

Subject areas for publication include:

Si-based Nano/Micro Electronic devices.
III-IV semiconductor devices.
2-D material Devices.
Electronic Sensors
Optoelectronics
Solar cell
Electromechanical system
Organic and molecular electronics
Electronic Circuits
Fabrication process
Measurement and characterization
Simulation technology on electronic devices and circuits
Modelling on electronic devices and circuits

Aims and Scope:

Semiconductors
Electronic devices
Fabrication processes
Characterizations
Simulations
Modelling

Lead Guest Editor

Zeheng Wang

University of Electronic Science and Technology of China, Chengdu, China

Guest Editors

Bhanu Shrestha

Department of Electronic Engineering, Kwangwoon University, Seoul, South Korea
wang yongsheng

Taiyuan University of Technology, Taiyuan, China
Muhammad Zeeshan Malik

Huaiyin Institute of Technology, Huaiyin, China
Yuanzhe Yao

University of Electronic Science and Technology of China, Chengdu, China
Mourad Hebali

Department of Electrical Engineering, University Mustapha Stambouli of Mascara, Mascara, Algeria
Kundan Kumar

KIIT Deemed to be University, Bhubaneswar, India
Ashok Kumar K

Department of ECE, Matrusri Engineering College, Osmania University, Hyderabad, India
Jawdat Abu Taha

Department of Electrical Engineering, Islamic University of Gaza, Gaza, Palestine
Emmanuel Nugroho

Indorama Engineering Polytechnic, Purwakarta, Indonesia
Deepak Punetha

Indian Institute of Technology Patna, Patna, India