International Journal of Mechanical Engineering and Applications

Special Issue

Mechanical Engineering and Applications on Semiconductor Industry

  • Submission Deadline: May 20, 2020
  • Status: Submission Closed
  • Lead Guest Editor: Jinfeng Wang
About This Special Issue
The issue will focus on mechanical engineering and application on semiconductor and green energy. With the development of AI and clean energy, higher requirement of mechanical devices are needed to fit with smaller but smarter silicon chips. Hope the issue can help journal have more attention from both academic and industrial readers.
Aims and Scope:
  1. Mechanical design for silicon chips
  2. Mechanical design and challenges for next generation devices
  3. AI and clean energy trend and requirement for mechanical engineering
Lead Guest Editor
  • Jinfeng Wang

    Engineering, Cabot Microelectronics, Aurora, United States

Guest Editors
  • Wei Fan

    Engineering, Cabot Microelectronics, Aurora, United States

  • Wei Wei

    Engineering, Cabot Microelectronics, Aurora, United States

  • Phil Fraundorf

    Physics, University of Missouri, St. Louis, United States

  • Wentao Qin

    R&D, On Semiconductor, Phoenix, United States

  • Qinmin Yang

    Mechanical Engineering Department, Zhejiang University, Hangzhou, China